Invention Grant
- Patent Title: Substrate unit
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Application No.: US16306940Application Date: 2017-06-06
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Publication No.: US10653019B2Publication Date: 2020-05-12
- Inventor: Koki Uchida
- Applicant: AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , Sumitomo Electric Industries, Ltd.
- Applicant Address: JP Yokkaichi, Mie JP Yokkaichi, Mie JP Osaka-Shi, Osaka
- Assignee: AutoNetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,Sumitomo Electric Industries, Ltd.
- Current Assignee: AutoNetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Yokkaichi, Mie JP Yokkaichi, Mie JP Osaka-Shi, Osaka
- Agency: Honigman LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@11577c3d
- International Application: PCT/JP2017/021002 WO 20170606
- International Announcement: WO2017/213144 WO 20171214
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K5/02

Abstract:
A substrate unit includes a circuit board; a connector portion mounted on the circuit board; and a case that contains the circuit board. The case includes a lower case having an accommodation section opened upward and accommodating the circuit board. An upper cover covers the accommodation section of the lower case. An aperture is opened in a side wall of the case, allowing the connector portion to be fitted to a counterpart connector portion. The upper cover includes a ceiling portion having a board opposing region that opposes the circuit board accommodated in the accommodation section and an outer region is located outside of the board opposing region without opposing the circuit board; and guide grooves inclined from the board opposing region to the outer region. The guide grooves discharging the water droplets away from the circuit board.
Public/Granted literature
- US20190150303A1 SUBSTRATE UNIT Public/Granted day:2019-05-16
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