Invention Grant
- Patent Title: Electronic module for arrangement to a transmission component and a method for arranging an electronic module to a transmission component
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Application No.: US16413982Application Date: 2019-05-16
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Publication No.: US10652995B2Publication Date: 2020-05-12
- Inventor: Hermann Josef Robin , Martin Hempen , Thomas Maier
- Applicant: ZF Friedrichshafen AG
- Applicant Address: DE Friedrichshafen
- Assignee: ZF Friedrichshafen AG
- Current Assignee: ZF Friedrichshafen AG
- Current Assignee Address: DE Friedrichshafen
- Agency: Brinks Gilson & Lione
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@b787195
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H05K5/00 ; H05K7/00 ; H05K1/02 ; H05K3/30 ; H05K1/18
Abstract:
The invention relates to an electronic module (100) mounted on a transmission component (112). The electronic module (100) comprises a printed circuit board element (102) that has component side (104) with at least one electronic component (108) and a contact side (106) lying opposite the component side (104), and a heat conducting film (110) that is placed between a surface section of the contact side (106) lying opposite the component (108) and a surface section of the transmission component (112). The printed circuit board element (102) can be or is tightened to the transmission component (112) such that the heat conducting film (110) is pressed against the surface section of the contact side (106) and the surface section of the transmission component (112).
Information query
