Invention Grant
- Patent Title: Electronic assembly and electronic device
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Application No.: US16188762Application Date: 2018-11-13
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Publication No.: US10652377B2Publication Date: 2020-05-12
- Inventor: Xiangkun Xie
- Applicant: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
- Applicant Address: CN Dongguan, Guangdong
- Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
- Current Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
- Current Assignee Address: CN Dongguan, Guangdong
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@29f05117 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@76618be8 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@440dde8c com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5543b8a7
- Main IPC: H04M1/02
- IPC: H04M1/02 ; H04B1/3827 ; H05K1/18 ; H04M1/03

Abstract:
The electronic assembly may include a flexible circuit board, a sensor, and a receiver. The flexible circuit board may include a first face and a second face opposite to the first face. The sensor may be disposed on the first face of the flexible circuit board and electrically connected to the flexible circuit board. The receiver may be disposed on the second face of the flexible circuit board. A sound channel for the receiver may be communicated to outside bypassing the flexible circuit board or through the flexible circuit board.
Public/Granted literature
- US20190208045A1 ELECTRONIC ASSEMBLY AND ELECTRONIC DEVICE Public/Granted day:2019-07-04
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