Invention Grant
- Patent Title: Packaged semiconductor devices with wireless charging means
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Application No.: US16132688Application Date: 2018-09-17
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Publication No.: US10651675B2Publication Date: 2020-05-12
- Inventor: Chen-Hua Yu , Hao-Yi Tsai , Tzu-Sung Huang , Ming-Hung Tseng , Hung-Yi Kuo
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L23/64 ; H01L23/10 ; H02J7/02 ; H01L21/3205 ; H01L23/31 ; H01L23/498 ; H01L23/538 ; H02J7/00 ; H02J50/10 ; H04B5/00 ; H01F27/36 ; H01F38/14
Abstract:
A semiconductor device package is provided, including a semiconductor device, a magnetic flux generation unit, a molding material, and a conductive slot. The magnetic flux generation unit is surrounding an axis and configured to produce magnetic flux passes through the magnetic flux generation unit. The molding material is surrounding the semiconductor device and the magnetic flux generation unit. The conductive slot is positioned over the molding material, wherein an opening is formed on the conductive slot, and the axis passes through the opening.
Public/Granted literature
- US20190020212A1 PACKAGED SEMICONDUCTOR DEVICES WITH WIRELESS CHARGING MEANS Public/Granted day:2019-01-17
Information query
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