Invention Grant
- Patent Title: Electrical connector with lower profile
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Application No.: US15865197Application Date: 2018-01-08
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Publication No.: US10651612B2Publication Date: 2020-05-12
- Inventor: Chih-Pi Cheng , Wen He , Quan Wang , Miao-Hui Gong , Chao-Chieh Chen
- Applicant: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
- Applicant Address: KY Grand Cayman
- Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
- Current Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
- Current Assignee Address: KY Grand Cayman
- Agent Wei Te Chung; Ming Chieh Chang
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@769afa4e
- Main IPC: H01R13/648
- IPC: H01R13/648 ; H01R24/60 ; H01R12/72 ; H01R107/00 ; H01R13/6587 ; H01R13/6581 ; H01R24/62 ; H01R13/6466 ; H01R13/6594

Abstract:
An electrical connector mounted on a PCB includes: an housing comprising a base, a mating tongue and a mounting portion, each surface of the mating tongue defining twelve terminal positions (P1) through (P12); two rows of terminals, each terminal including a mating portion, a leg portion and a middle portion connecting with the mating portion and the leg portion, each leg portion defining a soldering pad. Each row of terminals include grounding terminals in terminal positions (P1, P12) power terminals in terminal positions (P4, P9), and there are no terminals set in terminal positions (P2, P3, P10, P11). The soldering pads of the two rows of terminals are arranged in one row and at least two grounding terminals or two power terminals aligned with each other in a vertical direction are located side by side so as to share a same pad defined on the PCB.
Public/Granted literature
- US20180198246A1 ELECTRICAL CONNECTOR WITH LOWER PROFILE Public/Granted day:2018-07-12
Information query