Invention Grant
- Patent Title: Reduced transistor resistance using doped layer
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Application No.: US16325423Application Date: 2016-09-30
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Publication No.: US10651313B2Publication Date: 2020-05-12
- Inventor: Cheng-Ying Huang , Matthew V. Metz , Gilbert Dewey , Willy Rachmady , Jack T. Kavalieros , Sean T. Ma
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Trop, Pruner & Hu, P.C.
- International Application: PCT/US2016/054889 WO 20160930
- International Announcement: WO2018/063363 WO 20180405
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/786 ; H01L29/06 ; H01L29/423 ; B82Y10/00 ; H01L29/66 ; H01L29/775 ; H01L29/78 ; H01L29/417 ; H01L21/8234 ; H01L29/08 ; H01L27/24

Abstract:
An embodiment includes a transistor comprising: first, second, and third layers each including a group III-V material; a channel included in the second layer, which is between the first and third layers; and a gate having first and second gate portions; wherein (a)(i) the first and third layers are doped, (a)(ii) the channel is between the first and second gate portions and the second gate portion is between the channel and a substrate, (a)(iii) a first axis intersects the first, second, and third layers but not the first gate portion, and (a)(iv) a second axis, parallel to the first axis, intersects the first and second gate portions and the channel. Other embodiments are described herein.
Public/Granted literature
- US20190214500A1 REDUCED TRANSISTOR RESISTANCE USING DOPED LAYER Public/Granted day:2019-07-11
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