Invention Grant
- Patent Title: Array substrate and manufacturing method thereof
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Application No.: US15979335Application Date: 2018-05-14
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Publication No.: US10651257B2Publication Date: 2020-05-12
- Inventor: Sihang Bai
- Applicant: Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Applicant Address: CN Wuhan
- Assignee: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Current Assignee: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Wuhan
- Agency: Hemisphere Law, PLLC
- Agent Zhigang Ma
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@10b6b93d
- Main IPC: H01L27/32
- IPC: H01L27/32 ; H01L29/786 ; H01L51/56 ; H01L29/66 ; H01L51/00 ; H01L27/12 ; H01L51/52

Abstract:
The present disclosure provides a manufacturing method of an array substrate, including: forming a gate layer on a substrate; forming a gate insulating material layer on the gate layer; forming a polysilicon material layer on the gate insulating material layer; depositing an etch stop material layer on the polysilicon material layer; channel doping the polysilicon material layer; etching the polysilicon material layer, the etch stop material layer and the gate insulating material layer to form an active layer, an etch stop layer and a gate insulating layer; forming a source/drain layer on the active layer and the gate insulating layer, the active layer being electrically connected to the source/drain layer, and forming a through hole on the source/drain layer to form a source and a drain, the through hole being corresponding to the active layer, and both of the source and the drain being electrically connected to the active layer.
Public/Granted literature
- US20190189719A1 ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF Public/Granted day:2019-06-20
Information query
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