Invention Grant
- Patent Title: Semiconductor device and method for manufacturing same
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Application No.: US16438769Application Date: 2019-06-12
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Publication No.: US10651199B2Publication Date: 2020-05-12
- Inventor: Shinya Arai
- Applicant: Toshiba Memory Corporation
- Applicant Address: JP Minato-ku
- Assignee: Toshiba Memory Corporation
- Current Assignee: Toshiba Memory Corporation
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@27026bec
- Main IPC: H01L27/11582
- IPC: H01L27/11582 ; H01L27/11524 ; H01L27/1157 ; H01L27/11548 ; H01L27/11575 ; H01L21/764 ; H01L29/06 ; G11C16/14 ; H01L27/11573 ; H01L27/11556 ; G11C16/04 ; H01L27/11529 ; H01L21/311 ; H01L21/3213 ; H01L21/225 ; H01L29/167 ; H01L21/02

Abstract:
According to one embodiment, a source layer includes a semiconductor layer including an impurity. A stacked body includes a plurality of electrode layers stacked with an insulator interposed. A gate layer is provided between the source layer and the stacked body. The gate layer is thicker than a thickness of one layer of the electrode layers. A semiconductor body extends in a stacking direction of the stacked body through the stacked body and the gate layer. The semiconductor body further extends in the semiconductor layer where a side wall portion of the semiconductor body contacts the semiconductor layer. The semiconductor body does not contact the electrode layers and the gate layer.
Public/Granted literature
- US20190296046A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2019-09-26
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