The present disclosure includes: a flexible resin substrate made of a polyimide resin; an adhesion layer provided on the resin substrate; a semiconductor element mounted face down to the resin substrate and fixed to the resin substrate through the adhesion layer; a via hole provided in the resin substrate to correspond to an element electrode of the semiconductor element; a module electrode provided to the resin substrate to be in contact with the element electrode of the semiconductor element through the via hole; a protruding portion provided, around the element electrode or in a peripheral edge portion of the semiconductor element, on a surface of the semiconductor element; and an escape portion for the adhesion layer covering a head portion of the protruding portion to escape, the escape portion being provided in a region, of the resin substrate, corresponding to the protruding portion.