Invention Grant
- Patent Title: Environmental protection for wafer level and package level applications
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Application No.: US15797310Application Date: 2017-10-30
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Publication No.: US10651103B2Publication Date: 2020-05-12
- Inventor: Christo Bojkov , Andrew Ketterson , Robert Charles Dry
- Applicant: Qorvo US, Inc.
- Applicant Address: US NC Greensboro
- Assignee: Qorvo US, Inc.
- Current Assignee: Qorvo US, Inc.
- Current Assignee Address: US NC Greensboro
- Agency: Withrow & Terranova, P.L.L.C.
- Main IPC: H01L23/29
- IPC: H01L23/29 ; H01L23/00 ; H01L23/31 ; H01L21/56
Abstract:
A method includes the steps of fabricating one or more semiconductor devices on a semiconductor wafer and depositing one or more conformal organic environmental protection layers over the semiconductor wafer using a vapor deposition process. By depositing the one or more conformal organic environmental protection layers using a vapor deposition process, thin film conformal organic environmental protection layers may be provided that offer excellent protection against water and oxygen ingress, thus increasing the ruggedness and reliability of the resulting semiconductor die.
Public/Granted literature
- US20180122716A1 ENVIRONMENTAL PROTECTION FOR WAFER LEVEL AND PACKAGE LEVEL APPLICATIONS Public/Granted day:2018-05-03
Information query
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