Invention Grant
- Patent Title: Apparatus for flipping semiconductor device
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Application No.: US15666075Application Date: 2017-08-01
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Publication No.: US10651069B2Publication Date: 2020-05-12
- Inventor: Chih-Wei Wei , Chia-Liang Hsu
- Applicant: EPISTAR CORPORATION
- Applicant Address: TW Hsinchu
- Assignee: EPISTAR CORPORATION
- Current Assignee: EPISTAR CORPORATION
- Current Assignee Address: TW Hsinchu
- Agency: Ditthavong & Steiner, P.C.
- Main IPC: H01L21/68
- IPC: H01L21/68 ; H01L21/67 ; B21D37/14 ; B29C48/154 ; B29C35/10 ; B29C48/06 ; B29C48/19 ; B29C48/91 ; B29C48/88 ; B29C35/08
Abstract:
An apparatus for transferring a semiconductor device comprises platform comprising a carrier; a positioning unit above the platform and comprising an opening; and an elevating unit connecting the platform and the positioning unit; and a heater.
Public/Granted literature
- US20170330781A1 APPARATUS FOR FLIPPING SEMICONDUCTOR DEVICE Public/Granted day:2017-11-16
Information query
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