Invention Grant
- Patent Title: Metrology method in wafer transportation
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Application No.: US15879651Application Date: 2018-01-25
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Publication No.: US10651066B2Publication Date: 2020-05-12
- Inventor: Powen Huang , Yao-Yuan Shang , Kuo-Shu Tseng , Yen-Yu Chen , Chun-Chih Lin , Yi-Ming Dai
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/677 ; H01L21/673 ; H01L21/02 ; G01D7/00 ; G01D5/00 ; B08B3/04
Abstract:
A method for fault detection in a fabrication facility is provided. The method includes moving a wafer carrier using a transportation apparatus. The method further includes measuring an environmental condition within the wafer carrier or around the wafer carrier using a metrology tool positioned on the wafer carrier during the movement of the wafer carrier. The method also includes issuing a warning when the detected environmental condition is outside a range of acceptable values.
Public/Granted literature
- US20190164792A1 METROLOGY METHOD IN WAFER TRANSPORTATION Public/Granted day:2019-05-30
Information query
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