Invention Grant
- Patent Title: Apparatus and method for treating substrate
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Application No.: US16131587Application Date: 2018-09-14
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Publication No.: US10651059B2Publication Date: 2020-05-12
- Inventor: Judong Lee
- Applicant: SEMES CO., LTD.
- Applicant Address: KR Chungcheongnam-Do
- Assignee: SEMES CO., LTD.
- Current Assignee: SEMES CO., LTD.
- Current Assignee Address: KR Chungcheongnam-Do
- Agency: Li & Cai Intellectual Property (USA) Office
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6074ecee
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/02 ; H01L21/687 ; B08B3/02

Abstract:
Provided are an apparatus and a method for supplying a liquid. An apparatus for treating a substrate includes a substrate support unit to support the substrate, and a liquid supplying unit to supply a liquid to a substrate supported by the substrate support unit. The liquid supplying unit includes a nozzle to discharge the liquid, a liquid supplying line to supply the liquid to the nozzle, a constant pressure valve installed on the liquid supplying line, a shut-off valve installed on the liquid supplying line while being interposed between the constant pressure valve and the nozzle to supply the liquid or to stop the supply of the liquid, and a controller to control the constant pressure valve and the shut-off valve.
Public/Granted literature
- US20190103292A1 APPARATUS AND METHOD FOR TREATING SUBSTRATE Public/Granted day:2019-04-04
Information query
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