This invention has an object to provide an electrically conductive adhesive agent which enables a thermosetting resin to cure in a short time. It contains electrically conductive metallic powder including Sn, the thermosetting resin; an acid-anhydride-based hardening agent and an organic acid. The electrically conductive metallic powder and the organic acid are reacted during a heating process to produce an organic acid metal salt which is used as hardening accelerator. It enables thermosetting resin to cure in a short time, for example, a time equivalent to a time that is required for the general reflow process.