Invention Grant
- Patent Title: Method of making a stacked inductor-electronic package
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Application No.: US15453889Application Date: 2017-03-08
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Publication No.: US10643959B2Publication Date: 2020-05-05
- Inventor: Zaki Moussaoui , Nikhil Vishwanath Kelkar
- Applicant: INTERSIL AMERICAS LLC
- Applicant Address: US CA Milpitas
- Assignee: Intersil Americas LLC
- Current Assignee: Intersil Americas LLC
- Current Assignee Address: US CA Milpitas
- Agency: Foley & Lardner LLP
- Main IPC: H01L23/64
- IPC: H01L23/64 ; H01L23/31 ; H01L23/495 ; H01L25/16 ; H01L25/00 ; H01L23/367 ; H01L23/48 ; H01L23/00 ; H05K3/34

Abstract:
An embodiment of a circuit includes a circuit module and an inductor disposed over and electrically coupled to the module. Disposing the inductor over the module may reduce the area occupied by the circuit as compared to a circuit where the inductor is disposed adjacent to the module, or to a circuit where the inductor is disposed in the module adjacent to other components of the module. Furthermore, disposing the inductor outside of the module may allow one to install or replace the inductor.
Public/Granted literature
- US20200266159A9 METHOD OF MAKING A STACKED INDUCTOR-ELECTRONIC PACKAGE Public/Granted day:2020-08-20
Information query
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