Invention Grant
- Patent Title: Semiconductor device, electronic device, method of manufacturing semiconductor device, and method of manufacturing electronic device
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Application No.: US15676850Application Date: 2017-08-14
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Publication No.: US10595412B2Publication Date: 2020-03-17
- Inventor: Shinya Sasaki , Tsuyoshi Kanki
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Fujitsu Patent Center
- Priority: JP2016-169415 20160831
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/18 ; H01L21/48 ; H01L21/56 ; H01L23/14 ; H01L23/31 ; H01L23/538 ; H01L23/00 ; H05K3/34 ; H05K3/40 ; H01L23/498 ; H01L25/065 ; H01L25/00
Abstract:
A semiconductor device includes a printed circuit board that includes a first electrode, a resin substrate that includes a first face directed toward the printed circuit board, a second electrode formed in a second portion surrounding a first portion of the first face, a second face opposite the first face, and a third electrode formed in a third portion of the second face, the third portion overlapping the first portion in a plan view, a semiconductor chip that includes a coupling terminal joined to the third electrode, a conductive member that is formed between the printed circuit board and the resin substrate and contains a conductive particle and resin, and a solder bump that is formed between the printed circuit board and the resin substrate and is joined to the first electrode and the second electrode.
Public/Granted literature
Information query
