Invention Grant
- Patent Title: Light emitting device package and light emitting apparatus
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Application No.: US15755997Application Date: 2016-08-26
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Publication No.: US10593848B2Publication Date: 2020-03-17
- Inventor: Dong Hyun Yu , Bong Kul Min
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2015-0121635 20150828
- International Application: PCT/KR2016/009507 WO 20160826
- International Announcement: WO2017/039237 WO 20170309
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L23/495 ; H01L25/16 ; H01L33/48

Abstract:
A light-emitting element package according to one embodiment includes first and second lead frames electrically separated from each other; a package body including a slope configured to define a cavity along with at least one of the first or second lead frame; and at least one element unit disposed in an element area of at least one of the first or second lead frame, the element unit including a light-emitting element and a protective element, wherein the package body is disposed between the protective element and the light-emitting element.
Public/Granted literature
- US20180254392A1 LIGHT EMITTING DEVICE PACKAGE AND LIGHT EMITTING APPARATUS Public/Granted day:2018-09-06
Information query
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