Invention Grant
- Patent Title: Method and device for controlling operation using temperature deviation in multi-chip package
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Application No.: US16121949Application Date: 2018-09-05
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Publication No.: US10593650B2Publication Date: 2020-03-17
- Inventor: Min-Sang Park
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Volentine, Whitt & Francos, PLLC
- Priority: KR10-2015-0049952 20150408
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/34 ; G06F13/00 ; G11C11/406 ; H01L25/18 ; H01L23/00
Abstract:
A multi-chip package includes a first die having temperature sensors and a second die. The first die generates temperature deviation information of m (m
Public/Granted literature
- US20190006322A1 METHOD AND DEVICE FOR CONTROLLING OPERATION USING TEMPERATURE DEVIATION IN MULTI-CHIP PACKAGE Public/Granted day:2019-01-03
Information query
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