Invention Grant
- Patent Title: Multi-layer substrate with integrated resonator
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Application No.: US16025240Application Date: 2018-07-02
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Publication No.: US10587029B2Publication Date: 2020-03-10
- Inventor: Jeffrey Dekosky , Deepukumar M. Nair , Scott M. Knapp , Tarak A. Railkar , Lawrence A. Carastro , Timothy G. Kraus
- Applicant: Qorvo US, Inc.
- Applicant Address: US NC Greensboro
- Assignee: Qorvo US, Inc.
- Current Assignee: Qorvo US, Inc.
- Current Assignee Address: US NC Greensboro
- Agency: Withrow & Terranova, P.L.L.C.
- Main IPC: H01P7/10
- IPC: H01P7/10 ; H01P1/30 ; H03H1/00 ; H01P1/203

Abstract:
The present disclosure relates to a substrate that includes a substrate body and a resonator integrated within the substrate body. The resonator includes a resonator body, a top resonator plate, and a bottom resonator plate. The resonator body extends through the substrate body from a top surface to a bottom surface of the substrate body, and is formed of at least one of a dielectric material and a magnetic material. The top resonator plate is coupled to a top side of the resonator body and resides over the top surface of the substrate body, and the bottom resonator plate is coupled to a bottom side of the resonator body and resides over the bottom surface of the substrate body. The top resonator plate and the bottom resonator plate are electrically conductive.
Public/Granted literature
- US20190074571A1 MULTI-LAYER SUBSTRATE WITH INTEGRATED RESONATOR Public/Granted day:2019-03-07
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