Invention Grant
- Patent Title: Stressors for compressively strained GaN p-channel
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Application No.: US15774449Application Date: 2015-12-09
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Publication No.: US10586866B2Publication Date: 2020-03-10
- Inventor: Sansaptak Dasgupta , Marko Radosavljevic , Han Wui Then
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: US CA Santa Clara
- Agency: Finch & Maloney PLLC
- International Application: PCT/US2015/064742 WO 20151209
- International Announcement: WO2017/099752 WO 20170615
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/66 ; H01L29/08 ; H01L29/20 ; H01L29/205 ; H01L29/24 ; H01L29/267

Abstract:
Techniques are disclosed for increasing the performance of III-N p-channel devices, such as GaN p-channel transistors. Increased performance is obtained by applying compressive strain to the GaN p-channel. Compressive strain is applied to the GaN p-channel by epitaxially growing a source/drain material on or in the GaN. The source/drain material has a larger lattice constant than does the GaN and puts the p-channel under compressive strain. Numerous III-N material systems can be used.
Public/Granted literature
- US20180331222A1 STRESSORS FOR COMPRESSIVELY STRAINED GAN P-CHANNEL Public/Granted day:2018-11-15
Information query
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