- Patent Title: Semiconductor base having a composition graded buffer layer stack
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Application No.: US16077263Application Date: 2016-02-26
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Publication No.: US10586701B2Publication Date: 2020-03-10
- Inventor: Hiroshi Shikauchi , Ken Sato , Masaru Shinomiya , Keitaro Tsuchiya , Kazunori Hagimoto
- Applicant: SANKEN ELECTRIC CO., LTD. , SHIN-ETSU HANDOTAI CO., LTD.
- Applicant Address: JP Niiza JP Tokyo
- Assignee: SANKEN ELECTRIC CO., LTD.,SHIN-ETSU HANDOTAI CO., LTD.
- Current Assignee: SANKEN ELECTRIC CO., LTD.,SHIN-ETSU HANDOTAI CO., LTD.
- Current Assignee Address: JP Niiza JP Tokyo
- Agency: Oliff PLC
- International Application: PCT/JP2016/001060 WO 20160226
- International Announcement: WO2017/145199 WO 20170831
- Main IPC: H01L29/10
- IPC: H01L29/10 ; H01L29/20 ; H01L29/778 ; H01L21/02 ; H01L29/205 ; H01L29/66

Abstract:
Semiconductor base including: silicon-based substrate; buffer layer including first and second layers alternately on silicon-based substrate, first layer made of nitride-based compound semiconductor containing first material, second layer made of nitride-based compound semiconductor containing second material having larger lattice constant than first material; channel layer on buffer layer and made of nitride-based compound semiconductor containing second material, buffer layer has: first composition graded layer between at least one of first layers and second layer immediately thereabove, made of nitride-based compound semiconductor whose composition ratio of second material is increased gradually upward, whose composition ratio of first material is decreased gradually upward; second composition graded layer between at least one of second layers and first layer immediately thereabove, made of nitride-based compound semiconductor whose first material is increased gradually upward, whose composition ratio of second material is decreased gradually upward, first composition graded layer is thicker than second composition graded layer.
Public/Granted literature
- US20190051515A1 SEMICONDUCTOR BASE AND SEMICONDUCTOR DEVICE Public/Granted day:2019-02-14
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