Invention Grant
- Patent Title: Substrate processing method and substrate processing device
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Application No.: US15548183Application Date: 2015-12-28
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Publication No.: US10586695B2Publication Date: 2020-03-10
- Inventor: Takashi Ota , Taiki Hinode
- Applicant: SCREEN Holdings Co., Ltd.
- Applicant Address: JP
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: JP2015-021525 20150205
- International Application: PCT/JP2015/086540 WO 20151228
- International Announcement: WO2016/125421 WO 20160811
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/67
Abstract:
Method for performing cleaning treatment on a substrate having a fine pattern provided with a film formed on the surface, comprises: a silylating step of supplying a silylating agent to the surface of the substrate and silylating the surface of the substrate; and a liquid-chemical cleaning step of supplying a cleaning liquid chemical to the surface of the substrate and cleaning the surface of the substrate after, or simultaneously with, the silylating step.
Public/Granted literature
- US20180033605A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE Public/Granted day:2018-02-01
Information query
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