Invention Grant
- Patent Title: Relay apparatus
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Application No.: US15086689Application Date: 2016-03-31
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Publication No.: US10581760B2Publication Date: 2020-03-03
- Inventor: Kenji Aoki , Shinnosuke Matsuda , Katsuya Niigata , Sadayuki Ohyama
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Fujitsu Patent Center
- Priority: JP2015-093634 20150430
- Main IPC: H04L12/931
- IPC: H04L12/931 ; H05K7/02 ; H05K7/14 ; H05K7/18

Abstract:
A relay apparatus includes first and second board modules and a bridge module. The first board module is configured to relay the communications among the plurality of electronic devices, the plurality of electronic devices being connected to the first board module. The second board module is configured to relay the communications among the plurality of electronic devices, the plurality of electronic devices being connected to the second board module. The bridge module is configured to communicatively connect the first board module and the second board module.
Public/Granted literature
- US20160323206A1 RELAY APPARATUS Public/Granted day:2016-11-03
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