Invention Grant
- Patent Title: Low-profile board-to-board connector, mating connector, and connector assembly
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Application No.: US16252143Application Date: 2019-01-18
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Publication No.: US10581184B2Publication Date: 2020-03-03
- Inventor: Shiro Tsukashima , Daiki Tanaka , Naoto Yoshikawa
- Applicant: Molex, LLC
- Applicant Address: US IL Lisle
- Assignee: Molex, LLC
- Current Assignee: Molex, LLC
- Current Assignee Address: US IL Lisle
- Agency: Molex, LLC
- Priority: JP2018-033079 20180227
- Main IPC: H01R12/71
- IPC: H01R12/71 ; H01R12/57 ; H01R12/73 ; H01R13/115 ; H01R13/629 ; H01R13/405 ; H01R13/20 ; H01R12/89 ; H01R12/79 ; H01R12/00 ; H01R12/52

Abstract:
A connector includes a housing and terminals held by the housing, the housing includes flat plate-like terminal holding portions and contact portion storage opening opened to lower faces of the terminal holding portions. The terminals each have a main body, a U-shaped contact portion that is connected to a front end of the main body and protrudes downward, and a tip portion connected to a front end of the contact portion. The contact portion includes a pair of leg portions extending downward, and a bottom portion coupling lower ends of the leg portions to each other. The main body and the tip portion are integrally connected and held by the terminal holding portions, and the contact portion is stored in the contact portion storage opening.
Public/Granted literature
- US20190229447A1 CONNECTOR, MATING CONNECTOR, AND CONNECTOR ASSEMBLY Public/Granted day:2019-07-25
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