Invention Grant
- Patent Title: Antenna-integrated wireless module and method for manufacturing antenna-integrated wireless module
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Application No.: US15850818Application Date: 2017-12-21
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Publication No.: US10581157B2Publication Date: 2020-03-03
- Inventor: Yuichi Ito , Taro Hirai , Katsuhiko Fujikawa
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JP2013-156563 20130729; JP2013-172392 20130822
- Main IPC: H01Q1/52
- IPC: H01Q1/52 ; H01Q1/24 ; H01Q23/00 ; H01Q9/04

Abstract:
An antenna-integrated wireless module is provided which does not need a metal case, and which can realize size reduction. A shield layer is formed on an upper surface of a resin sealing layer, which is disposed on one principal surface of a substrate and which covers a wireless region and an antenna region, such that the shield layer does not cover a portion of the resin sealing layer, the portion being positioned directly above the antenna region. Hence the shield layer formed on the upper surface of the resin sealing layer on the side covering the wireless region can serve to suppress electromagnetic waves radiated from a wireless functional section, which is disposed in a region overlapping the wireless region when looking at the module in a plan view, and which includes an RF circuit disposed at least on the one principal surface of the substrate or inside the substrate.
Public/Granted literature
- US20180115061A1 ANTENNA-INTEGRATED WIRELESS MODULE AND METHOD FOR MANUFACTURING ANTENNA-INTEGRATED WIRELESS MODULE Public/Granted day:2018-04-26
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