The beneficial effects of the present application are as follows: the modified epoxy resin is doped with the modified epoxy resin in the buffer layer, the modified epoxy resin is reacted with the first barrier layer under UV irradiation, so that the modified epoxy resin is adhered to the first barrier layer to adhere the buffer layer and the first barrier layer and solve the technical problem that the organic layer and the inorganic layer are easily peeled off in the prior art. The present application also provides a packaging method and an electronic device.