Invention Grant
- Patent Title: Tightly integrated 1T1R ReRAM for planar technology
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Application No.: US16044077Application Date: 2018-07-24
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Publication No.: US10580977B2Publication Date: 2020-03-03
- Inventor: Alexander Reznicek , Takashi Ando , Pouya Hashemi
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent L. Jeffrey Kelly, Esq.
- Main IPC: H01L45/00
- IPC: H01L45/00 ; H01L29/08 ; H01L23/532 ; H01L27/24

Abstract:
A semiconductor structure includes an oxide ReRAM co-integrated with a drain region of a field effect transistor (FET). The oxide ReRAM has a tip region defined by a pointed cone that contacts a faceted upper surface of the drain region of the FET. Such a tip region enhances the electric field of the oxide ReRAM and thus helps to control forming of the conductive filament of the oxide ReRAM.
Public/Granted literature
- US20200035915A1 TIGHTLY INTEGRATED 1T1R ReRAM FOR PLANAR TECHNOLOGY Public/Granted day:2020-01-30
Information query
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