Invention Grant
- Patent Title: Semiconductor device and semiconductor module
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Application No.: US15961234Application Date: 2018-04-24
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Publication No.: US10580907B2Publication Date: 2020-03-03
- Inventor: Yoshiaki Toyoda , Hideaki Katakura
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki-shi, Kanagawa
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki-shi, Kanagawa
- Agency: Rabin & Berdo, P.C.
- Priority: JP2017-129908 20170630
- Main IPC: H01L29/861
- IPC: H01L29/861 ; H01L29/866 ; H01L25/18 ; H01L29/06 ; H01L29/36 ; H01L23/00 ; H01L29/08

Abstract:
A p+-type anode region that forms a contact of an anode electrode on a front surface of a semiconductor substrate and a p+-type starting substrate of a rear surface of the semiconductor substrate is formed on the front surface of the semiconductor substrate, whereby an up-anode type vertical diode is configured. The semiconductor substrate has a p−-type epitaxial layer stacked on the p+-type starting substrate, and a p-type transition layer in a surface layer of the p−-type epitaxial layer, facing the p+-type starting substrate. A p-type anode diffusion region is provided between a p+-type surface anode region and the p-type transition layer, and contacts the p+-type surface anode region and the p-type transition layer. A p-type impurity concentration of the p-type anode diffusion region decreases from an interface with the p+-type surface anode region toward an interface with the p-type transition layer.
Public/Granted literature
- US20190006527A1 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE Public/Granted day:2019-01-03
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