Invention Grant
- Patent Title: High-voltage semiconductor devices with improved EAS and related manufacturing method thereof
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Application No.: US15969974Application Date: 2018-05-03
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Publication No.: US10580862B2Publication Date: 2020-03-03
- Inventor: Wan Wen Tseng , Jen-Hao Yeh , Yi-Rong Tu , Chin-Wen Hsiung
- Applicant: Leadtrend Technology Corporation
- Applicant Address: TW Zhubei, Hsinchu County
- Assignee: LEADTREND TECHNOLOGY CORPORATION
- Current Assignee: LEADTREND TECHNOLOGY CORPORATION
- Current Assignee Address: TW Zhubei, Hsinchu County
- Agency: McClure, Qualey & Rodack, LLP
- Priority: TW106114740A 20170504
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/66 ; H01L29/78 ; H01L27/02 ; H01L29/423

Abstract:
A high-voltage semiconductor device has a main high-voltage switch device and a current-sense device for mirroring the current through the main high-voltage switch device. The main high-voltage switch device has a plurality of switch cells arranged to form a first array on a semiconductor substrate. Each switch cell has a first cell width. The current-sense device has a plurality of sense cells arranged to form a second array on the semiconductor substrate. Each sense cell has a second cell width larger than the first cell width. The switch cells and the sense cells share a common gate electrode and a common drain electrode.
Public/Granted literature
- US20180323258A1 HIGH-VOLTAGE SEMICONDUCTOR DEVICES WITH IMPROVED EAS AND RELATED MANUFACTURING METHOD THEREOF Public/Granted day:2018-11-08
Information query
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