Invention Grant
- Patent Title: High thermal budget compatible punch through stop integration using doped glass
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Application No.: US15790753Application Date: 2017-10-23
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Publication No.: US10580855B2Publication Date: 2020-03-03
- Inventor: Kangguo Cheng , Sanjay C. Mehta , Xin Miao , Chun-Chen Yeh
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Vazken Alexanian
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/66 ; H01L29/49 ; H01L29/10 ; H01L29/02 ; H01L29/78 ; H01L21/22 ; H01L21/3065 ; H01L21/308 ; H01L21/324 ; H01L29/08 ; H01L21/02

Abstract:
A method of forming a punch through stop region in a fin structure is disclosed. The method may include forming a doped glass layer on a fin structure and forming a masking layer on the doped glass layer. The method may further include removing a portion of the masking layer from an active portion of the fin structure, and removing an exposed portion the doped glass layer that is present on the active portion of the fin structure. A remaining portion of the doped glass layer is present on the isolation portion of the fin structure. Dopant from the doped glass layer may then be diffused into the isolation portion of the fin structure to form the punch through stop region between the active portion of the fin structure and a supporting substrate.
Public/Granted literature
- US20180061940A1 HIGH THERMAL BUDGET COMPATIBLE PUNCH THROUGH STOP INTEGRATION USING DOPED GLASS Public/Granted day:2018-03-01
Information query
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