Invention Grant
- Patent Title: Fabricating a vertical ReRAM array structure having reduced metal resistance
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Application No.: US16021062Application Date: 2018-06-28
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Publication No.: US10580829B2Publication Date: 2020-03-03
- Inventor: Takashi Ando , Pouya Hashemi , Choonghyun Lee
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Vazken Alexanian
- Main IPC: H01L27/24
- IPC: H01L27/24 ; H01L45/00

Abstract:
Embodiments of the invention include resulting structures and a method for fabricating a vertical ReRAM array structure. The embodiments of the invention include forming alternating layers over a metal layer of a structure, wherein a layer of the alternating layers comprises a low resistivity material, masking one or more portions of a topmost layer of the alternating layers, and etching one or more portions of the alternating layers down to the metal layer. Embodiments of the invention also include depositing a lateral electrode layer over the etched one or more portions of the alternating layers, performing an etch back on the lateral electrode layer, and forming a vertical electrode layer over the structures.
Public/Granted literature
- US20200006426A1 REDUCTION OF METAL RESISTANCE IN VERTICAL RERAM CELLS Public/Granted day:2020-01-02
Information query
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