Invention Grant
- Patent Title: Electronic device mounting board and electronic package
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Application No.: US16303047Application Date: 2017-05-17
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Publication No.: US10580711B2Publication Date: 2020-03-03
- Inventor: Kanae Horiuchi
- Applicant: KYOCERA Corporation
- Applicant Address: JP Kyoto
- Assignee: Kyocera Corporation
- Current Assignee: Kyocera Corporation
- Current Assignee Address: JP Kyoto
- Agency: Volpe and Koenig, P.C.
- Priority: JP2016-101295 20160520
- International Application: PCT/JP2017/018554 WO 20170517
- International Announcement: WO2017/200011 WO 20171123
- Main IPC: H01L23/12
- IPC: H01L23/12 ; H01L23/02 ; H01L23/34 ; H01L27/146 ; H01L31/024 ; H01L33/64 ; H01L23/15
Abstract:
An electronic device mounting board includes an inorganic substrate, a frame, and a bond. The inorganic substrate includes, on an upper surface, a mount area on which an electronic device is mountable, and a surrounding area surrounding the mount area. The frame is located in the surrounding area of the inorganic substrate to surround the mount area. The bond is located in the surrounding area between the inorganic substrate and the frame. The bond has a plurality of cavities.
Public/Granted literature
- US20190295910A1 ELECTRONIC DEVICE MOUNTING BOARD AND ELECTRONIC PACKAGE Public/Granted day:2019-09-26
Information query
IPC分类:
