A vapor deposition apparatus comprises a vacuum chamber, at least two movable holders and an alignment system. A pedestal, a backboard supported on the pedestal and a metal mask located above the backboard are disposed inside the vacuum chamber, wherein an anti-plasma coated layer is provided on the metal mask; each of the movable holders is configured to clamp an end of the metal mask on which a pulling force can be applied; and the alignment system is configured to drive the movable holders to move in at least one direction of a first direction and a second direction that are perpendicular to each other within a plane in parallel to the backboard and a third direction perpendicular to the plane to perform at least one of applying a pulling force on the metal mask and attaching the metal mask onto a preset location of the backboard.