Invention Grant
- Patent Title: Method for determining the dose corrections to be applied to an IC manufacturing process by a matching procedure
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Application No.: US15763829Application Date: 2016-10-05
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Publication No.: US10578978B2Publication Date: 2020-03-03
- Inventor: Mohamed Saib , Patrick Schiavone , Thiago Figueiro , Sébastien Bayle
- Applicant: ASELTA NANOGRAPHICS
- Applicant Address: FR Grenoble
- Assignee: ASELTA NANOGRAPHICS
- Current Assignee: ASELTA NANOGRAPHICS
- Current Assignee Address: FR Grenoble
- Agency: Baker & Hostetler LLP
- Priority: EP15306580 20151007
- International Application: PCT/EP2016/073744 WO 20161005
- International Announcement: WO2017/060273 WO 20170413
- Main IPC: G06F17/50
- IPC: G06F17/50 ; G03F7/20

Abstract:
A method is provided to easily determine the parameters of a second process for manufacturing from the parameters of a first process. Metrics representative of the differences between the two processes are computed from a number of values of the parameters, which can be measured for the two processes on a calibration layout, or which can be determined from pre-existing values for layouts or reference data for the two processes by an interpolation/extrapolation procedure. The number of metrics is selected so that their combination gives a precise representation of the differences between the two processes in all areas of a design. Advantageously, the metrics are calculated as a product of convolution of the target design and a compound of a kernel function and a deformation function. A reference physical model of the reference process is determined. A sizing correction to be applied to the edges of the design produced by the reference process is calculated. It is then converted, totally or partially, into a dose correction.
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