Invention Grant
- Patent Title: Wafer scoop assembly and method
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Application No.: US15794629Application Date: 2017-10-26
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Publication No.: US10578536B2Publication Date: 2020-03-03
- Inventor: Martin Atchison
- Applicant: Martin Atchison
- Agent Kenneth L. Nash; Thomas D. Nash
- Main IPC: G01N9/36
- IPC: G01N9/36 ; F16L9/00 ; F16L41/08 ; F16L41/10 ; G01N1/20 ; F16L27/00

Abstract:
A tubular scoop that may be utilized with various assemblies for sampling fluid in a pipeline. The scoop has a bend with a bend radius that is from two to four times the diameter of the scoop. The scoop defines a scoop face that is parallel to an axis of the tubular of the scoop. The scoop is mountable with a threaded connection that seals around the tubular. An additional seal with a compression nut allows orientation of the scoop within the pipeline whereupon the scoop orientation is fixed by tightening the compression nut.
Public/Granted literature
- US20180045632A1 WAFER SCOOP ASSEMBLY AND METHOD Public/Granted day:2018-02-15
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