Invention Grant
- Patent Title: Thermal insulation structure for heating device
-
Application No.: US16121538Application Date: 2018-09-04
-
Publication No.: US10578362B2Publication Date: 2020-03-03
- Inventor: Hsi-Ming Tseng , Li-Chih Liao
- Applicant: NATIONAL CHUNG-SHAN INSTITUTE OF SCIENCE & TECHNOLOGY , TEN WING SCIENTIFIC CO., LTD.
- Applicant Address: TW Taoyuan TW Taichung
- Assignee: National Chung-Shan Institute of Science & Technology,Ten Wing Scientific Co., Ltd.
- Current Assignee: National Chung-Shan Institute of Science & Technology,Ten Wing Scientific Co., Ltd.
- Current Assignee Address: TW Taoyuan TW Taichung
- Agency: Apex Juris, pllc.
- Agent R. Lynette Wylie
- Priority: TW106145855A 20171227
- Main IPC: F27D1/00
- IPC: F27D1/00 ; B32B7/00 ; B32B5/02 ; F24B1/24 ; F24C15/34 ; F24H1/18

Abstract:
A thermal insulation structure is disposed at an exterior of a chamber of a heating device. The thermal insulation structure includes a heat conduction layer, a heat storage layer and a reflection layer. The heat conduction layer is adapted to conduct heat from the chamber to the heat storage layer. The heat storage layer is adapted to store heat. The reflection layer is adapted to reflect radiation heat back to the chamber, whereby a temperature of the chamber could be kept at a constant so as to reduce heat dissipation of the chamber.
Public/Granted literature
- US20190195561A1 THERMAL INSULATION STRUCTURE FOR HEATING DEVICE Public/Granted day:2019-06-27
Information query