Invention Grant
- Patent Title: Conductive adhesive composition
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Application No.: US15780611Application Date: 2017-05-23
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Publication No.: US10577524B2Publication Date: 2020-03-03
- Inventor: Yoshihisa Yamamoto , Shigekazu Umemura
- Applicant: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Applicant Address: JP Osaka
- Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Current Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Potomoac Law Group, PLLC
- Agent Kenneth Fagin
- Priority: JP2016-102563 20160523
- International Application: PCT/JP2017/019210 WO 20170523
- International Announcement: WO2017/204218 WO 20171130
- Main IPC: C09J9/02
- IPC: C09J9/02 ; H01B1/20 ; H05K1/02 ; C08G59/68 ; C08G18/44 ; C08G18/73 ; C08G18/80 ; C08G59/40 ; C08G18/75 ; C08G18/42 ; C09J7/10 ; C08G18/48 ; C08G18/76 ; C09J11/04 ; C09J175/04 ; C09J7/25 ; C09J7/30 ; H05K9/00
Abstract:
Provided herein is a conductive adhesive composition containing: a thermosetting resin having a functional group reactive with an epoxy group; an epoxy resin; a conductive filler; and urethane resin particles having a mean particle diameter of 4 μm or more and 13 μm or less and a hardness of 55 or more and 90 or less measured by a type A durometer in conformity with JIS K6253.
Public/Granted literature
- US20190106607A1 Conductive Adhesive Composition Public/Granted day:2019-04-11
Information query
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