Invention Grant
- Patent Title: Micromachined ultrasound transducer using multiple piezoelectric materials
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Application No.: US15342719Application Date: 2016-11-03
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Publication No.: US10566949B2Publication Date: 2020-02-18
- Inventor: Stefon Shelton , Andre Guedes , Richard Przybyla , Meng-Hsiung Kiang , David Horsley
- Applicant: Chirp Microsystems, Inc.
- Applicant Address: US CA Berkeley
- Assignee: CHIRP MICROSYSTEMS, INC.
- Current Assignee: CHIRP MICROSYSTEMS, INC.
- Current Assignee Address: US CA Berkeley
- Agency: JDI Patent
- Agent Joshua D. Isenberg; Robert Pullman
- Main IPC: H03H9/17
- IPC: H03H9/17 ; B06B1/06 ; H03H9/02 ; H03H9/15

Abstract:
A transducer includes first and second piezoelectric layers made of corresponding different first and second piezoelectric materials and three or more electrodes, implemented in two or more conductive electrode layers. The first piezoelectric layer is sandwiched between a first pair of electrodes and the second piezoelectric layer is sandwiched between a second pair of electrodes. The first and second pairs of electrodes contain no more than one electrode that is common to both pairs.
Public/Granted literature
- US20170194934A1 MICROMACHINED ULTRASOUND TRANSDUCER USING MULTIPLE PIEZOELECTRIC MATERIALS Public/Granted day:2017-07-06
Information query
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