Invention Grant
- Patent Title: Semiconductor laser module
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Application No.: US15867833Application Date: 2018-01-11
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Publication No.: US10566761B2Publication Date: 2020-02-18
- Inventor: Masakazu Miura , Jun Miyokawa , Kazuki Yamaoka , Toshio Kimura
- Applicant: FURUKAWA ELECTRIC CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: G02B6/42
- IPC: G02B6/42 ; H01S5/022 ; H01S5/024

Abstract:
A semiconductor laser module includes a semiconductor laser that outputs laser light; an optical fiber that guides the laser light; a lens that couples the laser light, which is output from the semiconductor laser, with the optical fiber; a base that is substantially tabular in shape and that has the semiconductor laser, the optical fiber, and the lens fixed thereon either directly or indirectly; and a housing which houses the base and fixes the base either directly or indirectly. Among faces of the base, a face on a side that is fixed either directly or indirectly to the housing includes a junction plane that is joined to the housing either directly or indirectly, and a detachment plane that is detached to remain unfixed from the housing.
Public/Granted literature
- US20180138657A1 SEMICONDUCTOR LASER MODULE Public/Granted day:2018-05-17
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