Invention Grant
- Patent Title: Image sensor, stacked imaging device and imaging module
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Application No.: US15572609Application Date: 2016-04-19
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Publication No.: US10566548B2Publication Date: 2020-02-18
- Inventor: Yasuharu Ujiie , Masaki Murata , Yuya Kumagai , Hideaki Mogi , Shintarou Hirata
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sheridan Ross P.C.
- Priority: JP2016-007706 20160119
- International Application: PCT/JP2016/062377 WO 20160419
- International Announcement: WO2016/185858 WO 20161124
- Main IPC: H01B1/12
- IPC: H01B1/12 ; H01L51/00 ; H01L51/42 ; H01L27/30 ; H01L51/44
Abstract:
An image sensor includes at least a first electrode, a second electrode, an organic photoelectric conversion layer, and a carrier blocking layer. The carrier blocking layer is formed of a material having the following structural formula (1), and has a thickness of from 5×10−9 to 1.5×10−7 m:
Public/Granted literature
- US20180114926A1 IMAGE SENSOR, STACKED IMAGING DEVICE AND IMAGING MODULE Public/Granted day:2018-04-26
Information query
