Invention Grant
- Patent Title: High bandwidth routing for die to die interposer and on-chip applications
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Application No.: US16250854Application Date: 2019-01-17
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Publication No.: US10566286B2Publication Date: 2020-02-18
- Inventor: Sanjay Dabral , David A. Secker , Huabo Chen , Zhenggang Cheng
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: APPLE INC.
- Current Assignee: APPLE INC.
- Current Assignee Address: US CA Cupertino
- Agency: Jaffery Watson Mendonsa & Hamilton LLP
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/538 ; H01L23/498 ; H01L23/14 ; H01L23/00 ; H01L25/065
Abstract:
Routing structures including signal routing between die areas is described. In an embodiment, routing structures include signal lines with a characteristic thickness that is greater than a width. The signal lines may be twisted, and run directly underneath pads.
Public/Granted literature
- US20190189560A1 HIGH BANDWIDTH ROUTING FOR DIE TO DIE INTERPOSER AND ON-CHIP APPLICATIONS Public/Granted day:2019-06-20
Information query
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