Invention Grant
- Patent Title: Methods for semiconductor component design and for semiconductor component production and corresponding semiconductor components
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Application No.: US15592862Application Date: 2017-05-11
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Publication No.: US10566277B2Publication Date: 2020-02-18
- Inventor: Andreas Kuesel
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Shumaker & Sieffert, P.A.
- Priority: DE102016110384 20160606
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L29/66 ; H01L23/522 ; H01L29/06 ; H01L29/16 ; H01L29/43 ; H01L29/861
Abstract:
Methods for designing semiconductor components, for fabricating semiconductor components, and corresponding semiconductor components are provided. In this case, capacitance structures are either coupled to a supply network or used for rectifying design violations.
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