Invention Grant
- Patent Title: Power inductor with a chip structure
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Application No.: US15457235Application Date: 2017-03-13
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Publication No.: US10566128B2Publication Date: 2020-02-18
- Inventor: Young Su Jang , Bum Sik Wang , Jin Hwan Kim , Hwi Dae Kim , Min Ha Hwang
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2016-0079247 20160624
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F27/28

Abstract:
An inductor includes first and second coil patterns disposed in a single chip, and at least one common lead terminal electrically connected to respective end portions of the first and second coil patterns. The first and second coil patterns operate independently of each other, such that a range of a current passing through the first coil pattern and a range of a current passing through the second coil pattern are different from each other. The first and second coil patterns are coil patterns having different electrical characteristics.
Public/Granted literature
- US20170372833A1 POWER INDUCTOR WITH A CHIP STRUCTURE Public/Granted day:2017-12-28
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