Invention Grant
- Patent Title: Cooling circuit for vehicles
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Application No.: US16033547Application Date: 2018-07-12
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Publication No.: US10563563B2Publication Date: 2020-02-18
- Inventor: Ji Na Son
- Applicant: HYUNDAI MOTOR COMPANY , KIA MOTORS CORPORATION
- Applicant Address: KR Seoul KR Seoul
- Assignee: Hyundai Motor Company,Kia Motors Corporation
- Current Assignee: Hyundai Motor Company,Kia Motors Corporation
- Current Assignee Address: KR Seoul KR Seoul
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2017-0139022 20171025
- Main IPC: F01P3/20
- IPC: F01P3/20 ; F01P3/18 ; F01P5/10

Abstract:
A cooling circuit for a vehicle includes: an electronic device disposed on a sub-water-cooling line; an intercooler disposed in parallel with the electronic device on the sub-water-cooling line; and a sub-radiator disposed on the sub-water-cooling line and configured to cool cooling water which passes through the electronic device and the intercooler before passing through the sub-radiator.
Public/Granted literature
- US20190120118A1 COOLING CIRCUIT FOR VEHICLES Public/Granted day:2019-04-25
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