Invention Grant
- Patent Title: Resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the same
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Application No.: US15664156Application Date: 2017-07-31
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Publication No.: US10563006B2Publication Date: 2020-02-18
- Inventor: Guan-Syun Tseng , Ju-Ming Huang , Tsung-Hsien Lin , Chang-Chien Yang , Chih-Wei Liao
- Applicant: Taiwan Union Technology Corporation
- Applicant Address: TW Chupei, Hsinchu County
- Assignee: TAIWAN UNION TECHNOLOGY CORPORATION
- Current Assignee: TAIWAN UNION TECHNOLOGY CORPORATION
- Current Assignee Address: TW Chupei, Hsinchu County
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: C08G59/62
- IPC: C08G59/62 ; C08G59/40 ; H05K1/03 ; C08G59/32 ; C08G59/34 ; C08G59/68 ; C08J5/24 ; C08L63/04 ; H05K1/02 ; C08L63/00 ; C08K3/36
Abstract:
A resin composition is provided. The resin composition comprises an epoxy resin (A) and a first hardener (B) of the following formula (I): wherein Ar, R and n are as defined in the specification, and the molar ratio of the epoxy group of the epoxy resin to the active functional group of the first hardener ranges from about 1:0.4 to about 1:1.6.
Public/Granted literature
- US20180044467A1 Resin Composition, and Prepreg, Metal-Clad Laminate, and Printed Circuit Board Prepared Using the Same Public/Granted day:2018-02-15
Information query
IPC分类:
