Invention Grant
- Patent Title: Component mounting device
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Application No.: US15119762Application Date: 2014-02-25
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Publication No.: US10555448B2Publication Date: 2020-02-04
- Inventor: Hidetoshi Kawai
- Applicant: FUJI CORPORATION
- Applicant Address: JP Chiryu
- Assignee: FUJI CORPORATION
- Current Assignee: FUJI CORPORATION
- Current Assignee Address: JP Chiryu
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2014/054558 WO 20140225
- International Announcement: WO2015/128945 WO 20150903
- Main IPC: H05K13/04
- IPC: H05K13/04

Abstract:
The component mounting device determines suction deviation (posture change) of the component from after suction of the component until prior to mounting of the component based on an immediately post-suction image which is acquired by imaging the suction nozzle from the side immediately after suction of the component and an immediately pre-mounting image that is acquired by imaging the suction nozzle from the side immediately prior to mounting of the component.
Public/Granted literature
- US20170064883A1 COMPONENT MOUNTING DEVICE Public/Granted day:2017-03-02
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