- Patent Title: Heat dissipation structure and electronic device having the same
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Application No.: US16169955Application Date: 2018-10-24
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Publication No.: US10555438B2Publication Date: 2020-02-04
- Inventor: Yu-Wei Chang
- Applicant: Chiun Mai Communication Systems, Inc.
- Applicant Address: TW New Taipei
- Assignee: Chiun Mai Communication Systems, Inc.
- Current Assignee: Chiun Mai Communication Systems, Inc.
- Current Assignee Address: TW New Taipei
- Agency: ScienBiziP, P.C.
- Priority: CN201711037793 20171026
- Main IPC: H05K7/20
- IPC: H05K7/20 ; C09K5/04
Abstract:
A heat dissipation structure comprises a channel structure and a cooling material received and sealed in the channel structure. The cooling material is a low-boiling-point electrical insulating fluid. The channel structure is made of an electrical insulating material. The channel structure comprises an evaporation portion, a condenser portion, and at least one channel connecting the evaporation portion and the condenser portion. An electronic device using the heat dissipation structure is also provided.
Public/Granted literature
- US20190166721A1 HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE HAVING THE SAME Public/Granted day:2019-05-30
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