Invention Grant
- Patent Title: Optical element mounting package, electronic device, and electronic module
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Application No.: US15568241Application Date: 2016-04-18
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Publication No.: US10554012B2Publication Date: 2020-02-04
- Inventor: Mitsuharu Sakai , Yuusuke Takei
- Applicant: KYOCERA Corporation
- Applicant Address: JP Kyoto
- Assignee: KYOCERA CORPORATION
- Current Assignee: KYOCERA CORPORATION
- Current Assignee Address: JP Kyoto
- Agency: Volpe and Koenig, P.C.
- Priority: JP2015-089443 20150424; JP2016-033289 20160224
- International Application: PCT/JP2016/062261 WO 20160418
- International Announcement: WO2016/171103 WO 20161027
- Main IPC: H01S5/022
- IPC: H01S5/022 ; H01S5/024
Abstract:
An optical element mounting package includes a substrate including a recess comprising a bottom surface on which an optical element is to be mounted, and a side wall comprising an opening. The bottom surface of the recess has a cutout adjacent to the opening.
Public/Granted literature
- US20180145478A1 OPTICAL ELEMENT MOUNTING PACKAGE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE Public/Granted day:2018-05-24
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