- Patent Title: Electrical connector housing with hybrid structure via dual-molding
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Application No.: US16226513Application Date: 2018-12-19
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Publication No.: US10553969B2Publication Date: 2020-02-04
- Inventor: Tzu-Yao Hwang , Ke-Hao Chen
- Applicant: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD. , FOXCONN INTERCONNECT TECHNOLOGY LIMITED
- Applicant Address: CN Kunshan KY Grand Cayman
- Assignee: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.,FOXCONN INTERCONNECT TECHNOLOGY
- Current Assignee: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.,FOXCONN INTERCONNECT TECHNOLOGY
- Current Assignee Address: CN Kunshan KY Grand Cayman
- Agent Wei Te Chung; Ming Chieh Chang
- Priority: CN201711371480 20171219
- Main IPC: H01R12/70
- IPC: H01R12/70 ; H01R13/64 ; H01R13/639 ; H01R13/6461

Abstract:
An electrical for connecting an electronic package to a printed circuit board, includes a housing and a plurality of contacts therein. The contacts include grounding contacts and signal contacts mixed with each other. The housing includes an insulative plastic body and a conductive plastic body wherein the insulative plastic body includes a main plate and a plurality of columns extending downwardly from the main plate. Each column forms an insulative retaining passageway for receiving the signal contact. The conductive plastic body includes a block with two opposite top and bottom surfaces, and plurality of conductive retaining passageways for receiving the grounding contacts, and a plurality of receiving cavities for receiving the columns are commonly formed in the conductive plastic body in a mixed manner.
Public/Granted literature
- US20190190173A1 ELECTRICAL CONNECTOR HOUSING WITH HYBRID STRUCTURE VIA DUAL-MOLDING Public/Granted day:2019-06-20
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