Invention Grant
- Patent Title: Multiple stacked field-plated GaN transistor and interlayer dielectrics to improve breakdown voltage and reduce parasitic capacitances
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Application No.: US15777140Application Date: 2015-12-23
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Publication No.: US10553689B2Publication Date: 2020-02-04
- Inventor: Han Wui Then , Sansaptak Dasgupta , Marko Radosavljevic , Sanaz K. Gardner , Seung Hoon Sung
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- International Application: PCT/US2015/000317 WO 20151223
- International Announcement: WO2017/111795 WO 20170629
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L29/66 ; H01L29/78 ; H01L29/20 ; H01L21/765

Abstract:
Embodiments of the invention include a high voltage transistor with one or more field plates and methods of forming such transistors. According to an embodiment, the transistor may include a source region, a drain region, and a gate electrode formed over a channel region formed between the source region and drain region. Embodiments of the invention may also include a first interlayer dielectric (ILD) formed over the channel region and a second ILD formed over the first ILD. According to an embodiment, a first field plate may be formed in the second ILD. In an embodiment the first field plate is not formed as a single bulk conductive feature with the gate electrode. In some embodiments, the first field plate may be electrically coupled to the gate electrode by one or more vias. In alternative embodiments, the first field plate may be electrically isolated from the gate electrode.
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